This heat sink compound or thermal paste is designed for thermal coupling and will increase thermal conductivity in electronic components while providing efficient heat dissipation to keep them cool.

Features and Benefits
• Has high thermal conductivity to maximise heat transfer between the heat sink and heat source
• Provides excellent resistance to moisture to protect exposed components
• Formulated with a low metallic impurity content to ensure effective heat transfer between the heat generating component and the mechanical heat sink

Typical Applications
• Printed circuit boards
• Electronic components
• Control assemblies

Standards
• ISO 9001:2015

Warnings
• Do not mix with other products
• Do not use on energised equipment