Used for general splicing many lightweight coated papers
Repulpable: water and alkali dispersibility helps eliminate risk of contaminating paper mill broke with non-repulpable material; meets or exceeds TAPPI UM-213 procedure A
Excellent heat resistance in drying temperatures as high as 204 �C
Excellent adhesion: delaminates most papers, including many LWC formulations
Meets the requirements of indirect food additive regulations as described under 21 CFR 176.170 and 21 CFR 176.180



Suggested Applications
Use for overlap finished splice applications